Solidot Modbus TCP remote I/O module MT4 with 32 digital channels

Quantity	Unit price	Base price
To 3	€149.00*	€4.66* / 1 Channel
To 19	€141.55*	€4.42* / 1 Channel
To 39	€134.10*	€4.19* / 1 Channel
To 99	€126.65*	€3.96* / 1 Channel
From 100	€119.20*	€3.73* / 1 Channel

Prices excl. VAT plus shipping costs

Available, delivery time: 3 bis 5 Tage

Input and output variants

16 inputs (24 VDC) + 16 outputs (transistor)

32 inputs (24 V DC)

32 outputs (transistor 24 VDC)

Modul

Product number:

SD.MT4.3200B

Manufacturer no.:

MT4-3200B

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Product information "Solidot Modbus TCP remote I/O module MT4 with 32 digital channels"

Remote I/O as Modbus TCP extension, ideal for integration into Modbus TCP networks.

32 channels high I/O density for compact signal acquisition and output.

The configuration for the Solidot modules is also available in the eplan Data Portal

Electrical properties
Nominal supply voltage:	24 V DC
Permissible voltage range:	18 - 36 V DC
Digital I/O
Digital inputs (number & type):	32 (24 V DC PNP)
Switch display:	Green LED
Switch type:	PNP
Analogue I/O
Analog inputs (number):	none
Analog outputs (number):	none
Interfaces, protocols and connections
Ethernet:	2 x 10/100 (RJ45)
Fieldbuses & protocols:	Modbus TCP slave (server)
Interfaces:	Ethernet
Modbus:	Modbus TCP server (slave)
Terminal type:	Spring clamp
Dimensions and environmental properties
Assembly:	DIN rail
Cooling:	Ambient air (passive)
Dimensions (width x height x depth):	25 mm x 102 mm x 72 mm
Housing material:	Plastic
Moisture:	5 % - 95 % (non-condensing)
Operating temperature range:	0 °C to +55 °C
Protection class:	IP20
Storage temperature range:	- 20 °C to + 70 °C
Other properties
Model series:	MT4
Programming
Configurable via:	Web Browser
Certifications
CE certificate:	Yes

Manufacturer "Solidot"

Solidot was only founded in 2012 and is therefore still a relatively young company. It is now a leading manufacturer of remote I/O in Asia. The company specializes entirely in remote I/O and offers a wide variety of different bus couplers, form factors and assemblies.

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